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1 Ergebnisse
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Measuring Double-Sided Thermal Resistance of Press-Pack IGB..:
Guo, Chunsheng
;
Cui, Shaoxiong
;
Tsai, Wenyi
...
IEEE Transactions on Electron Devices. 70 (2023) 4 - p. 1776-1781 , 2023
Link:
https://doi.org/10.1109/ted.2023.3250183
RT Journal T1 <Title>Measuring Double-Sided Thermal Resistance of Press-Pack IGBT Modules Based on Ratio of Double-Sided Heat Dissipation</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_ted.2023.3250183&Exemplar=1&LAN=DE A1 Guo, Chunsheng A1 Cui, Shaoxiong A1 Tsai, Wenyi A1 Liu, Yunong A1 Ding, Juewen A1 Li, Jinyuan A1 Chen, Zhongyuan A1 Li, Yaosheng A1 Pan, Shijie A1 Feng, Shiwei PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 0018-9383 SN 1557-9646 JF IEEE Transactions on Electron Devices VO 70 IS 4 SP 1776 OP 1781 LK http://dx.doi.org/https://doi.org/10.1109/ted.2023.3250183 DO https://doi.org/10.1109/ted.2023.3250183 SF ELIB - SuUB Bremen
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