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1 Ergebnisse
1
Ultralow-k Amorphous Boron Nitride Film for Copper Intercon..:
Kim, Kiryong
;
Kim, Hyeongjoon
;
Lee, Sun-Woo
...
IEEE Transactions on Electron Devices. 70 (2023) 5 - p. 2588-2593 , 2023
Link:
https://doi.org/10.1109/ted.2023.3258403
RT Journal T1 <Title>Ultralow-k Amorphous Boron Nitride Film for Copper Interconnect Capping Layer</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_ted.2023.3258403&Exemplar=1&LAN=DE A1 Kim, Kiryong A1 Kim, Hyeongjoon A1 Lee, Sun-Woo A1 Lee, Min Yung A1 Lee, Gyusoup A1 Park, Youngkeun A1 Kim, Heetae A1 Lee, Yun Hee A1 Kim, Minsu A1 Ma, Kyung Yeol A1 Kim, Min Ju A1 Kim, Taek-Soo A1 Shin, Hyeon Suk A1 Cho, Byung Jin PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 0018-9383 SN 1557-9646 JF IEEE Transactions on Electron Devices VO 70 IS 5 SP 2588 OP 2593 LK http://dx.doi.org/https://doi.org/10.1109/ted.2023.3258403 DO https://doi.org/10.1109/ted.2023.3258403 SF ELIB - SuUB Bremen
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