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1 Ergebnisse
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Superjunction Reliability Analysis Under Extreme High Posit..:
Xu, Hang
;
Feng, Tianyang
;
Li, Xianghui
..
IEEE Transactions on Electron Devices. 70 (2023) 6 - p. 3179-3184 , 2023
Link:
https://doi.org/10.1109/ted.2023.3266189
RT Journal T1 <Title>Superjunction Reliability Analysis Under Extreme High Positive and Negative Gate Voltage Stress</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_ted.2023.3266189&Exemplar=1&LAN=DE A1 Xu, Hang A1 Feng, Tianyang A1 Li, Xianghui A1 Yang, Yafen A1 Zhang, David Wei PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 0018-9383 SN 1557-9646 JF IEEE Transactions on Electron Devices VO 70 IS 6 SP 3179 OP 3184 LK http://dx.doi.org/https://doi.org/10.1109/ted.2023.3266189 DO https://doi.org/10.1109/ted.2023.3266189 SF ELIB - SuUB Bremen
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