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Line-to-Line TDDB Modeling: LER Specs for Sub-20-nm Pitch I..:

Fang, Yu ; Ciofi, I. ; Roussel, Ph. J....
IEEE Transactions on Electron Devices.  70 (2023)  8 - p. 4332-4337 , 2023
Link: https://doi.org/10.1109/ted.2023.3287168