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1 Ergebnisse
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Pixel-Parallel Three-Layer Stacked CMOS Image Sensors Using..:
Goto, Masahide
;
Honda, Yuki
;
Nanba, Masakazu
...
IEEE Transactions on Electron Devices. 70 (2023) 9 - p. 4705-4711 , 2023
Link:
https://doi.org/10.1109/ted.2023.3298308
RT Journal T1
Pixel-Parallel Three-Layer Stacked CMOS Image Sensors Using Double-Sided Hybrid Bonding of SOI Wafers
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_ted.2023.3298308&Exemplar=1&LAN=DE A1 Goto, Masahide A1 Honda, Yuki A1 Nanba, Masakazu A1 Iguchi, Yoshinori A1 Saraya, Takuya A1 Kobayashi, Masaharu A1 Higurashi, Eiji A1 Toshiyoshi, Hiroshi A1 Hiramoto, Toshiro PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 0018-9383 SN 1557-9646 JF IEEE Transactions on Electron Devices VO 70 IS 9 SP 4705 OP 4711 LK http://dx.doi.org/https://doi.org/10.1109/ted.2023.3298308 DO https://doi.org/10.1109/ted.2023.3298308 SF ELIB - SuUB Bremen
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