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1 Ergebnisse
1
200-mm Si CMOS Process-Compatible Integrated Passive Device..:
Park, Minsik
;
Song, Jonghyun
;
Jeong, Jaeyong
...
IEEE Transactions on Electron Devices. 70 (2023) 10 - p. 5257-5264 , 2023
Link:
https://doi.org/10.1109/ted.2023.3302817
RT Journal T1
200-mm Si CMOS Process-Compatible Integrated Passive Device Stack for Millimeter-Wave Monolithic 3-D Integration
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_ted.2023.3302817&Exemplar=1&LAN=DE A1 Park, Minsik A1 Song, Jonghyun A1 Jeong, Jaeyong A1 Lim, Jeong-Taek A1 Song, Jae-Hyeok A1 Lee, Won-Chul A1 Sim, Gapseop A1 Cho, Huijae A1 Yoo, Dongeun A1 Kang, Minho A1 Ko, Hyoungho A1 Lee, Jooseok A1 Yang, Kyounghoon A1 Kim, Choul-Young A1 Kim, Youngsu A1 Sul, Woo-Suk A1 Kim, Sanghyeon A1 Lee, Jongwon PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 0018-9383 SN 1557-9646 JF IEEE Transactions on Electron Devices VO 70 IS 10 SP 5257 OP 5264 LK http://dx.doi.org/https://doi.org/10.1109/ted.2023.3302817 DO https://doi.org/10.1109/ted.2023.3302817 SF ELIB - SuUB Bremen
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