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3-D Stackable Offset-Via Antifuse by Cu BEOL Process in Adv..:

Yeh, Li-Yu ; Chang, Ya-Lin ; Chih, Yue-Der...
IEEE Transactions on Electron Devices.  70 (2023)  12 - p. 6273-6278 , 2023
Link: https://doi.org/10.1109/ted.2023.3318884