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1 Ergebnisse
1
Metal Boundary Effect Mitigation by HKMG Thermal Process Op..:
Li, Zhao-Yang
;
Wang, Xue-Jiao
;
Jiang, Yu-Long
IEEE Transactions on Electron Devices. 71 (2024) 4 - p. 2335-2341 , 2024
Link:
https://doi.org/10.1109/ted.2024.3370119
RT Journal T1
Metal Boundary Effect Mitigation by HKMG Thermal Process Optimization in FinFET Integration Technology
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_ted.2024.3370119&Exemplar=1&LAN=DE A1 Li, Zhao-Yang A1 Wang, Xue-Jiao A1 Jiang, Yu-Long PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 0018-9383 SN 1557-9646 JF IEEE Transactions on Electron Devices VO 71 IS 4 SP 2335 OP 2341 LK http://dx.doi.org/https://doi.org/10.1109/ted.2024.3370119 DO https://doi.org/10.1109/ted.2024.3370119 SF ELIB - SuUB Bremen
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