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1 Ergebnisse
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A Fully Coupled Model of Multi-Chip Press-Pack IGBT for The..:
Zhan, Cao
;
Zhu, Lingyu
;
Zhang, Yaxin
...
IEEE Transactions on Industry Applications. 58 (2022) 3 - p. 3852-3862 , 2022
Link:
https://doi.org/10.1109/tia.2022.3160412
RT Journal T1 <Title>A Fully Coupled Model of Multi-Chip Press-Pack IGBT for Thermo-Mechanical Stress Distribution Prediction</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tia.2022.3160412&Exemplar=1&LAN=DE A1 Zhan, Cao A1 Zhu, Lingyu A1 Zhang, Yaxin A1 Dai, Jiangang A1 Hou, Ting A1 Song, Ying A1 Ji, Shengchang A1 Iannuzzo, Francesco PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 0093-9994 SN 1939-9367 JF IEEE Transactions on Industry Applications VO 58 IS 3 SP 3852 OP 3862 LK http://dx.doi.org/https://doi.org/10.1109/tia.2022.3160412 DO https://doi.org/10.1109/tia.2022.3160412 SF ELIB - SuUB Bremen
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