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1 Ergebnisse
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A Dynamic Load-Shedding Technology Based on IEC 61850 in Mi..:
Gu, Jyh-Cherng
;
Hsu, Lin-Chen
;
Wang, Jing-Min
.
IEEE Transactions on Industry Applications. 59 (2023) 6 - p. 7382-7391 , 2023
Link:
https://doi.org/10.1109/tia.2023.3305341
RT Journal T1 <Title>A Dynamic Load-Shedding Technology Based on IEC 61850 in Microgrid</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tia.2023.3305341&Exemplar=1&LAN=DE A1 Gu, Jyh-Cherng A1 Hsu, Lin-Chen A1 Wang, Jing-Min A1 Yang, Ming-Ta PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 0093-9994 SN 1939-9367 JF IEEE Transactions on Industry Applications VO 59 IS 6 SP 7382 OP 7391 LK http://dx.doi.org/https://doi.org/10.1109/tia.2023.3305341 DO https://doi.org/10.1109/tia.2023.3305341 SF ELIB - SuUB Bremen
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