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Toward Characterizing 3-D Microwave Field With Microscale R..:

Wang, Ding ; Wen, Huan Fei ; Li, Xin...
IEEE Transactions on Instrumentation and Measurement.  72 (2023)  - p. 1-7 , 2023
Link: https://doi.org/10.1109/tim.2023.3322476