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Heat Conduction Enhancement of a Thermal Interface Material..:
Mouane, Othmane
;
Sideras-Haddad, Elias
;
Nkadimeng, Edward
...
IEEE Transactions on Nanotechnology. 21 (2022) - p. 352-359 , 2022
Link:
https://doi.org/10.1109/tnano.2022.3186102
RT Journal T1
Heat Conduction Enhancement of a Thermal Interface Material for Heat Sink Applications Using Carbon Nanomaterials
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tnano.2022.3186102&Exemplar=1&LAN=DE A1 Mouane, Othmane A1 Sideras-Haddad, Elias A1 Nkadimeng, Edward A1 Mckenzie, Ryan A1 Van Rensburg, Roger A1 Sandrock, Charles A1 Mellado, Bruce A1 Coville, Neil J. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 1536-125X SN 1941-0085 JF IEEE Transactions on Nanotechnology VO 21 SP 352 OP 359 LK http://dx.doi.org/https://doi.org/10.1109/tnano.2022.3186102 DO https://doi.org/10.1109/tnano.2022.3186102 SF ELIB - SuUB Bremen
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