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1 Ergebnisse
1
Thermal Contact Resistance Optimization of Press-Pack IGBT ..:
Wang, Xiao
;
Li, Hui
;
Yao, Ran
...
IEEE Transactions on Power Electronics. 37 (2022) 5 - p. 5411-5421 , 2022
Link:
https://doi.org/10.1109/tpel.2021.3129846
RT Journal T1 <Title>Thermal Contact Resistance Optimization of Press-Pack IGBT Device Based on Liquid Metal Thermal Interface Material</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tpel.2021.3129846&Exemplar=1&LAN=DE A1 Wang, Xiao A1 Li, Hui A1 Yao, Ran A1 Lai, Wei A1 Liu, Renkuan A1 Yu, Renze A1 Chen, Xianping A1 Li, Jinyuan PB Institute of Electrical and Electronics Engineers (IEEE) YR 2022 SN 0885-8993 SN 1941-0107 JF IEEE Transactions on Power Electronics VO 37 IS 5 SP 5411 OP 5421 LK http://dx.doi.org/https://doi.org/10.1109/tpel.2021.3129846 DO https://doi.org/10.1109/tpel.2021.3129846 SF ELIB - SuUB Bremen
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