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1 Ergebnisse
1
Design and Evaluation of a Face-Down Embedded SiC Power Mod..:
Sun, Xinnan
;
Chen, Min
;
Li, Bodong
...
IEEE Transactions on Power Electronics. 38 (2023) 3 - p. 2799-2804 , 2023
Link:
https://doi.org/10.1109/tpel.2022.3214893
RT Journal T1 <Title>Design and Evaluation of a Face-Down Embedded SiC Power Module With Low Parasitic Inductance and Low Thermal Resistance</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tpel.2022.3214893&Exemplar=1&LAN=DE A1 Sun, Xinnan A1 Chen, Min A1 Li, Bodong A1 Hou, Fengze A1 Zhang, Dongbo A1 Li, Jie A1 Du, Yifei A1 Jiang, Feng PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 0885-8993 SN 1941-0107 JF IEEE Transactions on Power Electronics VO 38 IS 3 SP 2799 OP 2804 LK http://dx.doi.org/https://doi.org/10.1109/tpel.2022.3214893 DO https://doi.org/10.1109/tpel.2022.3214893 SF ELIB - SuUB Bremen
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