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1 Ergebnisse
1
Impedance Reshaping Band Coupling and Broadband Passivity E..:
Hu, Bin
;
Nian, Heng
;
Li, Haipan
...
IEEE Transactions on Power Electronics. 38 (2023) 8 - p. 9436-9447 , 2023
Link:
https://doi.org/10.1109/tpel.2023.3270364
RT Journal T1 <Title>Impedance Reshaping Band Coupling and Broadband Passivity Enhancement for DFIG System</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tpel.2023.3270364&Exemplar=1&LAN=DE A1 Hu, Bin A1 Nian, Heng A1 Li, Haipan A1 Chen, Liang A1 Sahoo, Subham A1 Blaabjerg, Frede PB Institute of Electrical and Electronics Engineers (IEEE) YR 2023 SN 0885-8993 SN 1941-0107 JF IEEE Transactions on Power Electronics VO 38 IS 8 SP 9436 OP 9447 LK http://dx.doi.org/https://doi.org/10.1109/tpel.2023.3270364 DO https://doi.org/10.1109/tpel.2023.3270364 SF ELIB - SuUB Bremen
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