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1 Ergebnisse
1
Opportunities and Challenges of Pressure Contact Packaging ..:
Wang, Lei
;
Wang, Wenbo
;
Zeng, Keqiu
...
IEEE Transactions on Power Electronics. 39 (2024) 2 - p. 2401-2419 , 2024
Link:
https://doi.org/10.1109/tpel.2023.3332050
RT Journal T1 <Title>Opportunities and Challenges of Pressure Contact Packaging for Wide Bandgap Power Modules</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tpel.2023.3332050&Exemplar=1&LAN=DE A1 Wang, Lei A1 Wang, Wenbo A1 Zeng, Keqiu A1 Deng, Junyun A1 Rietveld, Gert A1 Hueting, Raymond J. E. PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 0885-8993 SN 1941-0107 JF IEEE Transactions on Power Electronics VO 39 IS 2 SP 2401 OP 2419 LK http://dx.doi.org/https://doi.org/10.1109/tpel.2023.3332050 DO https://doi.org/10.1109/tpel.2023.3332050 SF ELIB - SuUB Bremen
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