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1 Ergebnisse
1
Development of SiC Power Module Structure by Micron-Sized A..:
Chen, Chuantong
;
Suetake, Aiji
;
Huo, Fupeng
...
IEEE Transactions on Power Electronics. 39 (2024) 9 - p. 10638-10650 , 2024
Link:
https://doi.org/10.1109/tpel.2024.3408798
RT Journal T1
Development of SiC Power Module Structure by Micron-Sized Ag-Paste Sinter Joining on Both Die and Heatsink to Low-Thermal-Resistance and Superior Power Cycling Reliability
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tpel.2024.3408798&Exemplar=1&LAN=DE A1 Chen, Chuantong A1 Suetake, Aiji A1 Huo, Fupeng A1 Kim, Dongjin A1 Zhang, Zheng A1 Hsieh, Ming-Chun A1 Li, Wanli A1 Wakasugi, Naoki A1 Takeshita, Kazutaka A1 Yamaguchi, Yoshiji A1 Momose, Yashima A1 Suganuma, Katsuaki PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 0885-8993 SN 1941-0107 JF IEEE Transactions on Power Electronics VO 39 IS 9 SP 10638 OP 10650 LK http://dx.doi.org/https://doi.org/10.1109/tpel.2024.3408798 DO https://doi.org/10.1109/tpel.2024.3408798 SF ELIB - SuUB Bremen
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