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1 Ergebnisse
1
In-Situ Monitoring Solder Layer Degradation in Multichip IG..:
Yang, Jianxiong
;
Che, Yanbo
;
Ran, Li
..
IEEE Transactions on Power Electronics. 39 (2024) 10 - p. 13744-13757 , 2024
Link:
https://doi.org/10.1109/tpel.2024.3412918
RT Journal T1 <Title>In-Situ Monitoring Solder Layer Degradation in Multichip IGBT Power Modules Using Auxiliary Emitter Voltage</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tpel.2024.3412918&Exemplar=1&LAN=DE A1 Yang, Jianxiong A1 Che, Yanbo A1 Ran, Li A1 Hu, Borong A1 Du, Mingxing PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 0885-8993 SN 1941-0107 JF IEEE Transactions on Power Electronics VO 39 IS 10 SP 13744 OP 13757 LK http://dx.doi.org/https://doi.org/10.1109/tpel.2024.3412918 DO https://doi.org/10.1109/tpel.2024.3412918 SF ELIB - SuUB Bremen
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