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1 Ergebnisse
1
Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathi..:
Yeo, Siang Miang
;
Yow, Ho Kwang
;
Yeoh, Keat Hoe
.
IEEE Transactions on Reliability. 73 (2024) 1 - p. 784-791 , 2024
Link:
https://doi.org/10.1109/tr.2023.3294224
RT Journal T1
Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tr.2023.3294224&Exemplar=1&LAN=DE A1 Yeo, Siang Miang A1 Yow, Ho Kwang A1 Yeoh, Keat Hoe A1 Azenal, Siti Nur Farhana Mohamad PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 0018-9529 SN 1558-1721 JF IEEE Transactions on Reliability VO 73 IS 1 SP 784 OP 791 LK http://dx.doi.org/https://doi.org/10.1109/tr.2023.3294224 DO https://doi.org/10.1109/tr.2023.3294224 SF ELIB - SuUB Bremen
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