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1 Ergebnisse
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Improving the Reliability of Through Silicon Vias: Reducing..:
Choi, Won-Jun
;
Yoo, Myong Jae
;
Bae, Joonho
..
IEEE Transactions on Semiconductor Manufacturing. 37 (2024) 2 - p. 166-173 , 2024
Link:
https://doi.org/10.1109/tsm.2024.3378160
RT Journal T1 <Title>Improving the Reliability of Through Silicon Vias: Reducing Copper Protrusion by Artificial Defect Manipulation and Annealing</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tsm.2024.3378160&Exemplar=1&LAN=DE A1 Choi, Won-Jun A1 Yoo, Myong Jae A1 Bae, Joonho A1 Seo, Ji-Hun A1 Lee, Churl Seung PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 0894-6507 SN 1558-2345 JF IEEE Transactions on Semiconductor Manufacturing VO 37 IS 2 SP 166 OP 173 LK http://dx.doi.org/https://doi.org/10.1109/tsm.2024.3378160 DO https://doi.org/10.1109/tsm.2024.3378160 SF ELIB - SuUB Bremen
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