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Wafer Dicing Vibration Investigation on Novel Wafer Mountin..:
Amri, Mohd Syahrin
;
Omar, Ghazali
;
Mispan, Mohd Syafiq
...
IEEE Transactions on Semiconductor Manufacturing. , 2024
Link:
https://doi.org/10.1109/tsm.2024.3435338
RT Journal T1 <Title>Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tsm.2024.3435338&Exemplar=1&LAN=DE A1 Amri, Mohd Syahrin A1 Omar, Ghazali A1 Mispan, Mohd Syafiq A1 Harun, Fuaida A1 Othman, MNB. A1 Ngatiman, N.A. A1 Ibrahim, Masrullizam Mat PB Institute of Electrical and Electronics Engineers (IEEE) YR 2024 SN 0894-6507 SN 1558-2345 JF IEEE Transactions on Semiconductor Manufacturing SP 1 OP 1 LK http://dx.doi.org/https://doi.org/10.1109/tsm.2024.3435338 DO https://doi.org/10.1109/tsm.2024.3435338 SF ELIB - SuUB Bremen
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