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Yield Enhancement by Bad-Die Recycling and Stacking With Th..:

Chou, Yung-Fa ; Kwai, Ding-Ming ; Wu, Cheng-Wen
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  19 (2011)  8 - p. 1346-1356 , 2011
Link: https://doi.org/10.1109/tvlsi.2010.2051466