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Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive ..:

Chi, Chun-Chuan ; Marinissen, Erik Jan ; Goel, Sandeep Kumar.
IEEE Transactions on Very Large Scale Integration (VLSI) Systems.  22 (2014)  11 - p. 2388-2401 , 2014
Link: https://doi.org/10.1109/tvlsi.2013.2293192