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1 Ergebnisse
1
Via-Switch FPGA: Highly Dense Mixed-Grained Reconfigurable ..:
Ochi, Hiroyuki
;
Yamaguchi, Kosei
;
Fujimoto, Tetsuaki
...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 26 (2018) 12 - p. 2723-2736 , 2018
Link:
https://doi.org/10.1109/tvlsi.2018.2812914
RT Journal T1
Via-Switch FPGA: Highly Dense Mixed-Grained Reconfigurable Architecture With Overlay Via-Switch Crossbars
UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tvlsi.2018.2812914&Exemplar=1&LAN=DE A1 Ochi, Hiroyuki A1 Yamaguchi, Kosei A1 Fujimoto, Tetsuaki A1 Hotate, Junshi A1 Kishimoto, Takashi A1 Higashi, Toshiki A1 Imagawa, Takashi A1 Doi, Ryutaro A1 Tada, Munehiro A1 Sugibayashi, Tadahiko A1 Takahashi, Wataru A1 Wakabayashi, Kazutoshi A1 Onodera, Hidetoshi A1 Mitsuyama, Yukio A1 Yu, Jaehoon A1 Hashimoto, Masanori PB Institute of Electrical and Electronics Engineers (IEEE) YR 2018 SN 1063-8210 SN 1557-9999 JF IEEE Transactions on Very Large Scale Integration (VLSI) Systems VO 26 IS 12 SP 2723 OP 2736 LK http://dx.doi.org/https://doi.org/10.1109/tvlsi.2018.2812914 DO https://doi.org/10.1109/tvlsi.2018.2812914 SF ELIB - SuUB Bremen
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