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1 Ergebnisse
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Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type..:
Lin, Jai-Ming
;
Chang, Wei-Yi
;
Hsieh, Hao-Yuan
...
IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 29 (2021) 9 - p. 1652-1664 , 2021
Link:
https://doi.org/10.1109/tvlsi.2021.3100343
RT Journal T1 <Title>Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1109_tvlsi.2021.3100343&Exemplar=1&LAN=DE A1 Lin, Jai-Ming A1 Chang, Wei-Yi A1 Hsieh, Hao-Yuan A1 Shyu, Ya-Ting A1 Chang, Yeong-Jar A1 Lu, Juin-Ming PB Institute of Electrical and Electronics Engineers (IEEE) YR 2021 SN 1063-8210 SN 1557-9999 JF IEEE Transactions on Very Large Scale Integration (VLSI) Systems VO 29 IS 9 SP 1652 OP 1664 LK http://dx.doi.org/https://doi.org/10.1109/tvlsi.2021.3100343 DO https://doi.org/10.1109/tvlsi.2021.3100343 SF ELIB - SuUB Bremen
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