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1 Ergebnisse
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Analysis of thermal strain of metallized silicon nitride su..:
Ngo, Minh Chu
;
Miyazaki, Hiroyuki
;
Hirao, Kiyoshi
.
International Journal of Applied Ceramic Technology. 21 (2023) 2 - p. 1032-1041 , 2023
Link:
https://doi.org/10.1111/ijac.14565
RT Journal T1
Analysis of thermal strain of metallized silicon nitride substrate under cyclic thermal loading by digital image correlation
UL https://suche.suub.uni-bremen.de/peid=cr-10.1111_ijac.14565&Exemplar=1&LAN=DE A1 Ngo, Minh Chu A1 Miyazaki, Hiroyuki A1 Hirao, Kiyoshi A1 Fukushima, Manabu PB Wiley YR 2023 SN 1546-542X SN 1744-7402 JF International Journal of Applied Ceramic Technology VO 21 IS 2 SP 1032 OP 1041 LK http://dx.doi.org/https://doi.org/10.1111/ijac.14565 DO https://doi.org/10.1111/ijac.14565 SF ELIB - SuUB Bremen
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