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Investigation of the Depth and Rate of Ion Etching of QWIP ..:
Trukhachev, A. V.
;
Sednev, M. V.
;
Trukhacheva, N. S.
..
Journal of Communications Technology and Electronics. 66 (2021) 3 - p. 358-361 , 2021
Link:
https://doi.org/10.1134/s1064226921030190
RT Journal T1 <Title>Investigation of the Depth and Rate of Ion Etching of QWIP Structures</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1134_s1064226921030190&Exemplar=1&LAN=DE A1 Trukhachev, A. V. A1 Sednev, M. V. A1 Trukhacheva, N. S. A1 Boltar, K. O. A1 Dirochka, A. I. PB Pleiades Publishing Ltd YR 2021 SN 1064-2269 SN 1555-6557 JF Journal of Communications Technology and Electronics VO 66 IS 3 SP 358 OP 361 LK http://dx.doi.org/https://doi.org/10.1134/s1064226921030190 DO https://doi.org/10.1134/s1064226921030190 SF ELIB - SuUB Bremen
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