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Transfer bonding technology for batch fabrication of SMA mi..:
Grund, T.
;
Guerre, R.
;
Despont, M.
.
The European Physical Journal Special Topics. 158 (2008) 1 - p. 237-242 , 2008
Link:
https://doi.org/10.1140/epjst/e2008-00681-3
RT Journal T1 <Title>Transfer bonding technology for batch fabrication of SMA microactuators</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1140_epjst_e2008-00681-3&Exemplar=1&LAN=DE A1 Grund, T. A1 Guerre, R. A1 Despont, M. A1 Kohl, M. PB Springer Science and Business Media LLC YR 2008 SN 1951-6355 SN 1951-6401 JF The European Physical Journal Special Topics VO 158 IS 1 SP 237 OP 242 LK http://dx.doi.org/https://doi.org/10.1140/epjst/e2008-00681-3 DO https://doi.org/10.1140/epjst/e2008-00681-3 SF ELIB - SuUB Bremen
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