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1 Ergebnisse
1
Submicrometer Gold Interconnect Wiringby Sidewall Electropl..:
Hirano, Makoto
;
Shinji Aoyama, Shinji Aoyama
;
Kimiyoshi Yamasaki, Kimiyoshi Yamasaki
Japanese Journal of Applied Physics. 33 (1994) 4A - p. L553 , 1994
Link:
https://doi.org/10.1143/jjap.33.l553
RT Journal T1
Submicrometer Gold Interconnect Wiringby Sidewall Electroplating Technology
UL https://suche.suub.uni-bremen.de/peid=cr-10.1143_jjap.33.l553&Exemplar=1&LAN=DE A1 Hirano, Makoto A1 Shinji Aoyama, Shinji Aoyama A1 Kimiyoshi Yamasaki, Kimiyoshi Yamasaki PB IOP Publishing YR 1994 SN 0021-4922 SN 1347-4065 JF Japanese Journal of Applied Physics VO 33 IS 4A SP L553 LK http://dx.doi.org/https://doi.org/10.1143/jjap.33.l553 DO https://doi.org/10.1143/jjap.33.l553 SF ELIB - SuUB Bremen
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