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1 Ergebnisse
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Improvement of Photo-Misalignment in Patterned Wafer Bondin..:
Lee, Ki-Hong
;
Cha, Gi-Ho
;
Bae, Geum-Jong
...
Japanese Journal of Applied Physics. 38 (1999) 6R - p. 3487 , 1999
Link:
https://doi.org/10.1143/jjap.38.3487
RT Journal T1
Improvement of Photo-Misalignment in Patterned Wafer Bonding Process for Silicon-on-Insulator Device
UL https://suche.suub.uni-bremen.de/peid=cr-10.1143_jjap.38.3487&Exemplar=1&LAN=DE A1 Lee, Ki-Hong A1 Cha, Gi-Ho A1 Bae, Geum-Jong A1 Lee, Kyung-Wook A1 Kim, Il-Kwon A1 Lee, Sang In A1 Lee, Moon Yong PB IOP Publishing YR 1999 SN 0021-4922 SN 1347-4065 JF Japanese Journal of Applied Physics VO 38 IS 6R SP 3487 LK http://dx.doi.org/https://doi.org/10.1143/jjap.38.3487 DO https://doi.org/10.1143/jjap.38.3487 SF ELIB - SuUB Bremen
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