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1 Ergebnisse
1
Submicron Via-Hole Filling using Al Low-Pressure Seed Proce..:
Yun, Jong-Ho
;
Kim, Ku-Young
;
Jin, Sung-Gon
...
Japanese Journal of Applied Physics. 40 (2001) 8R - p. 5105 , 2001
Link:
https://doi.org/10.1143/jjap.40.5105
RT Journal T1
Submicron Via-Hole Filling using Al Low-Pressure Seed Process
UL https://suche.suub.uni-bremen.de/peid=cr-10.1143_jjap.40.5105&Exemplar=1&LAN=DE A1 Yun, Jong-Ho A1 Kim, Ku-Young A1 Jin, Sung-Gon A1 Yoon, Kyoung-Ryul A1 Lee, Sang-Hwa A1 Ryu, In-Cheol A1 Park, Sung-Ki PB IOP Publishing YR 2001 SN 0021-4922 SN 1347-4065 JF Japanese Journal of Applied Physics VO 40 IS 8R SP 5105 LK http://dx.doi.org/https://doi.org/10.1143/jjap.40.5105 DO https://doi.org/10.1143/jjap.40.5105 SF ELIB - SuUB Bremen
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