I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Adhesion Characteristics between Chemical Vapor Deposited C..:
Kim, Young Suk
;
Hamamura, Hirotaka
;
Shimogaki, Yukihiro
Japanese Journal of Applied Physics. 41 (2002) Part 1, No. 3A - p. 1500-1506 , 2002
Link:
https://doi.org/10.1143/jjap.41.1500
RT Journal T1 <Title>Adhesion Characteristics between Chemical Vapor Deposited Cu and TiN Films: Aspects of Process Integration</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1143_jjap.41.1500&Exemplar=1&LAN=DE A1 Kim, Young Suk A1 Hamamura, Hirotaka A1 Shimogaki, Yukihiro PB IOP Publishing YR 2002 SN 0021-4922 SN 1347-4065 JF Japanese Journal of Applied Physics VO 41 IS Part 1, No. 3A SP 1500 OP 1506 LK http://dx.doi.org/https://doi.org/10.1143/jjap.41.1500 DO https://doi.org/10.1143/jjap.41.1500 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
