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1 Ergebnisse
1
Chemically Vapor Deposited Cu Films on Ar-Plasma-Treated Ti..:
Lin, Cheng-Li
;
Chen, Peng-Sen
;
Chen, Mao-Chieh
Japanese Journal of Applied Physics. 41 (2002) Part 1, No. 1 - p. 280-286 , 2002
Link:
https://doi.org/10.1143/jjap.41.280
RT Journal T1 <Title>Chemically Vapor Deposited Cu Films on Ar-Plasma-Treated TiN Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1143_jjap.41.280&Exemplar=1&LAN=DE A1 Lin, Cheng-Li A1 Chen, Peng-Sen A1 Chen, Mao-Chieh PB IOP Publishing YR 2002 SN 0021-4922 SN 1347-4065 JF Japanese Journal of Applied Physics VO 41 IS Part 1, No. 1 SP 280 OP 286 LK http://dx.doi.org/https://doi.org/10.1143/jjap.41.280 DO https://doi.org/10.1143/jjap.41.280 SF ELIB - SuUB Bremen
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