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Force Driving Cu Diffusion into Interlayer Dielectrics:
Fukuda, Takuya
;
Nishino, Hirotaka
;
Matsuura, Azuma
.
Japanese Journal of Applied Physics. 41 (2002) Part 2, No. 5B - p. L537-L539 , 2002
Link:
https://doi.org/10.1143/jjap.41.l537
RT Journal T1 <Title>Force Driving Cu Diffusion into Interlayer Dielectrics</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1143_jjap.41.l537&Exemplar=1&LAN=DE A1 Fukuda, Takuya A1 Nishino, Hirotaka A1 Matsuura, Azuma A1 Matsunaga, Hironori PB IOP Publishing YR 2002 SN 0021-4922 JF Japanese Journal of Applied Physics VO 41 IS Part 2, No. 5B SP L537 OP L539 LK http://dx.doi.org/https://doi.org/10.1143/jjap.41.l537 DO https://doi.org/10.1143/jjap.41.l537 SF ELIB - SuUB Bremen
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