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Influence of Physical Characteristics of Ceria Particles on..:
Kim, Sang-Kyun
;
Yoon, Phil-Won
;
Paik, Ungyu
..
Japanese Journal of Applied Physics. 43 (2004) 11A - p. 7427-7433 , 2004
Link:
https://doi.org/10.1143/jjap.43.7427
RT Journal T1 <Title>Influence of Physical Characteristics of Ceria Particles on Polishing Rate of Chemical Mechanical Planarization for Shallow Trench Isolation</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1143_jjap.43.7427&Exemplar=1&LAN=DE A1 Kim, Sang-Kyun A1 Yoon, Phil-Won A1 Paik, Ungyu A1 Katoh, Takeo A1 Park, Jea-Gun PB IOP Publishing YR 2004 SN 0021-4922 SN 1347-4065 JF Japanese Journal of Applied Physics VO 43 IS 11A SP 7427 OP 7433 LK http://dx.doi.org/https://doi.org/10.1143/jjap.43.7427 DO https://doi.org/10.1143/jjap.43.7427 SF ELIB - SuUB Bremen
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