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1 Ergebnisse
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Copper Plating Method on Flat Surface for High Frequency Si..:
Hontake, Koichi
;
Wakizaka, Yasuhiro
;
Furuya, Akihiko
...
Japanese Journal of Applied Physics. 44 (2005) 9R - p. 6719 , 2005
Link:
https://doi.org/10.1143/jjap.44.6719
RT Journal T1
Copper Plating Method on Flat Surface for High Frequency Signal Transfer
UL https://suche.suub.uni-bremen.de/peid=cr-10.1143_jjap.44.6719&Exemplar=1&LAN=DE A1 Hontake, Koichi A1 Wakizaka, Yasuhiro A1 Furuya, Akihiko A1 Uchida, Daisuke A1 Kuribayashi, Koichiro A1 Noda, Tomoko A1 Sugimura, Masahiko A1 Chikuma, Mitsuyasu A1 Toki, Sotaro A1 Sasaki, Jun A1 Hagiwara, Muneaki A1 Nakada, Akira A1 Kubota, Hiroshi PB IOP Publishing YR 2005 SN 0021-4922 SN 1347-4065 JF Japanese Journal of Applied Physics VO 44 IS 9R SP 6719 LK http://dx.doi.org/https://doi.org/10.1143/jjap.44.6719 DO https://doi.org/10.1143/jjap.44.6719 SF ELIB - SuUB Bremen
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