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1 Ergebnisse
1
Effect of Interfacial Microstructures on the Bonding Streng..:
Kim, Jae-Myeong
;
Jeong, Myeong-Hyeok
;
Yoo, Sehoon
.
Japanese Journal of Applied Physics. 51 (2012) 5S - p. 05EE06 , 2012
Link:
https://doi.org/10.1143/jjap.51.05ee06
RT Journal T1
Effect of Interfacial Microstructures on the Bonding Strength of Sn–3.0Ag–0.5Cu Pb-Free Solder Bump
UL https://suche.suub.uni-bremen.de/peid=cr-10.1143_jjap.51.05ee06&Exemplar=1&LAN=DE A1 Kim, Jae-Myeong A1 Jeong, Myeong-Hyeok A1 Yoo, Sehoon A1 Park, Young-Bae PB IOP Publishing YR 2012 SN 0021-4922 SN 1347-4065 JF Japanese Journal of Applied Physics VO 51 IS 5S SP 05EE06 LK http://dx.doi.org/https://doi.org/10.1143/jjap.51.05ee06 DO https://doi.org/10.1143/jjap.51.05ee06 SF ELIB - SuUB Bremen
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