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Allocating power ground vias in 3D ICs for simultaneous pow..:
Yu, Hao
;
Ho, Joanna
;
He, Lei
ACM Transactions on Design Automation of Electronic Systems. 14 (2009) 3 - p. 1-31 , 2009
Link:
https://doi.org/10.1145/1529255.1529263
RT Journal T1 <Title>Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1145_1529255.1529263&Exemplar=1&LAN=DE A1 Yu, Hao A1 Ho, Joanna A1 He, Lei PB Association for Computing Machinery (ACM) YR 2009 SN 1084-4309 SN 1557-7309 JF ACM Transactions on Design Automation of Electronic Systems VO 14 IS 3 SP 1 OP 31 LK http://dx.doi.org/https://doi.org/10.1145/1529255.1529263 DO https://doi.org/10.1145/1529255.1529263 SF ELIB - SuUB Bremen
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