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1 Ergebnisse
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Thermal-aware memory mapping in 3D designs:
Hsieh, Ang-Chih
;
Hwang, Tingting
ACM Transactions on Embedded Computing Systems. 13 (2013) 1 - p. 1-22 , 2013
Link:
https://doi.org/10.1145/2512457
RT Journal T1 <Title>Thermal-aware memory mapping in 3D designs</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1145_2512457&Exemplar=1&LAN=DE A1 Hsieh, Ang-Chih A1 Hwang, Tingting PB Association for Computing Machinery (ACM) YR 2013 SN 1539-9087 SN 1558-3465 JF ACM Transactions on Embedded Computing Systems VO 13 IS 1 SP 1 OP 22 LK http://dx.doi.org/https://doi.org/10.1145/2512457 DO https://doi.org/10.1145/2512457 SF ELIB - SuUB Bremen
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