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A Cost-Effective Built-In Self-Test Mechanism for Post-Manu..:
Maity, Dilip Kumar
;
Roy, Surajit Kumar
;
Giri, Chandan
ACM Journal on Emerging Technologies in Computing Systems. 18 (2022) 4 - p. 1-23 , 2022
Link:
https://doi.org/10.1145/3517808
RT Journal T1 <Title>A Cost-Effective Built-In Self-Test Mechanism for Post-Manufacturing TSV Defects in 3D ICs</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1145_3517808&Exemplar=1&LAN=DE A1 Maity, Dilip Kumar A1 Roy, Surajit Kumar A1 Giri, Chandan PB Association for Computing Machinery (ACM) YR 2022 SN 1550-4832 SN 1550-4840 JF ACM Journal on Emerging Technologies in Computing Systems VO 18 IS 4 SP 1 OP 23 LK http://dx.doi.org/https://doi.org/10.1145/3517808 DO https://doi.org/10.1145/3517808 SF ELIB - SuUB Bremen
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