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1 Ergebnisse
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ILP-based Substrate Routing with Mismatched Via Dimension C..:
Wu, Jun-Sheng
;
Pan, Chi-An
;
Liu, Yi-Yu
ACM Transactions on Design Automation of Electronic Systems. 28 (2023) 5 - p. 1-26 , 2023
Link:
https://doi.org/10.1145/3579843
RT Journal T1 <Title>ILP-based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1145_3579843&Exemplar=1&LAN=DE A1 Wu, Jun-Sheng A1 Pan, Chi-An A1 Liu, Yi-Yu PB Association for Computing Machinery (ACM) YR 2023 SN 1084-4309 SN 1557-7309 JF ACM Transactions on Design Automation of Electronic Systems VO 28 IS 5 SP 1 OP 26 LK http://dx.doi.org/https://doi.org/10.1145/3579843 DO https://doi.org/10.1145/3579843 SF ELIB - SuUB Bremen
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