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1 Ergebnisse
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SkyBridge 2.0: A Fine-grained Vertical 3D-IC Technology for..:
Bhat, Sachin
;
Li, Mingyu
;
Kulkarni, Sourabh
.
ACM Journal on Emerging Technologies in Computing Systems. 19 (2023) 4 - p. 1-19 , 2023
Link:
https://doi.org/10.1145/3617501
RT Journal T1 <Title>SkyBridge 2.0: A Fine-grained Vertical 3D-IC Technology for Future ICs</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1145_3617501&Exemplar=1&LAN=DE A1 Bhat, Sachin A1 Li, Mingyu A1 Kulkarni, Sourabh A1 Moritz, Csaba Andras PB Association for Computing Machinery (ACM) YR 2023 SN 1550-4832 SN 1550-4840 JF ACM Journal on Emerging Technologies in Computing Systems VO 19 IS 4 SP 1 OP 19 LK http://dx.doi.org/https://doi.org/10.1145/3617501 DO https://doi.org/10.1145/3617501 SF ELIB - SuUB Bremen
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