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Ceramic Substrates for Microelectronic Packaging:
Chowdhry, U
;
Sleight, A W
Annual Review of Materials Science. 17 (1987) 1 - p. 323-340 , 1987
Link:
https://doi.org/10.1146/annurev.ms.17.080187.001543
RT Journal T1 <Title>Ceramic Substrates for Microelectronic Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1146_annurev.ms.17.080187.001543&Exemplar=1&LAN=DE A1 Chowdhry, U A1 Sleight, A W PB Annual Reviews YR 1987 SN 0084-6600 JF Annual Review of Materials Science VO 17 IS 1 SP 323 OP 340 LK http://dx.doi.org/https://doi.org/10.1146/annurev.ms.17.080187.001543 DO https://doi.org/10.1146/annurev.ms.17.080187.001543 SF ELIB - SuUB Bremen
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