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1 Ergebnisse
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Surface Inspection of Cu-Cu Non-Thermal Compression Bonding..:
Kwon, Doowon
;
Song, Young-Uk
;
Kang, Pilkyu
...
ECS Transactions. 64 (2014) 5 - p. 77-82 , 2014
Link:
https://doi.org/10.1149/06405.0077ecst
RT Journal T1
Surface Inspection of Cu-Cu Non-Thermal Compression Bonding for Wafer-to-Wafer 3D Stacking
UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_06405.0077ecst&Exemplar=1&LAN=DE A1 Kwon, Doowon A1 Song, Young-Uk A1 Kang, Pilkyu A1 Oh, Taeseok A1 Moon, Chang-Rok A1 Lee, Duckhyung PB The Electrochemical Society YR 2014 SN 1938-5862 SN 1938-6737 JF ECS Transactions VO 64 IS 5 SP 77 OP 82 LK http://dx.doi.org/https://doi.org/10.1149/06405.0077ecst DO https://doi.org/10.1149/06405.0077ecst SF ELIB - SuUB Bremen
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