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Characteristics of DC Reactively Sputtered (Ti,Zr)N Thin Fi..:
Kuo, Yu-Lin
;
Lee, Chiapyng
;
Lin, Jing-Cheng
...
Electrochemical and Solid-State Letters. 6 (2003) 9 - p. C123 , 2003
Link:
https://doi.org/10.1149/1.1592913
RT Journal T1 <Title>Characteristics of DC Reactively Sputtered (Ti,Zr)N Thin Films as Diffusion Barriers for Cu Metallization</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_1.1592913&Exemplar=1&LAN=DE A1 Kuo, Yu-Lin A1 Lee, Chiapyng A1 Lin, Jing-Cheng A1 Peng, Chao-Hsien A1 Chen, Li-Chien A1 Hsieh, Ching-Hua A1 Shue, Shau-Lin A1 Liang, Mong-Song A1 Daniels, Brian J. A1 Huang, Cheng-Lin A1 Lai, Chih-Huang PB The Electrochemical Society YR 2003 SN 1099-0062 JF Electrochemical and Solid-State Letters VO 6 IS 9 SP C123 LK http://dx.doi.org/https://doi.org/10.1149/1.1592913 DO https://doi.org/10.1149/1.1592913 SF ELIB - SuUB Bremen
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