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1 Ergebnisse
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Measurement of Adhesion Strength in Copper Interconnection ..:
Hara, Tohru
;
Uchida, Minoru
;
Fujimoto, Masayo
...
Electrochemical and Solid-State Letters. 7 (2004) 2 - p. G28 , 2004
Link:
https://doi.org/10.1149/1.1635092
RT Journal T1
Measurement of Adhesion Strength in Copper Interconnection Layers
UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_1.1635092&Exemplar=1&LAN=DE A1 Hara, Tohru A1 Uchida, Minoru A1 Fujimoto, Masayo A1 Doy, Toshiroh K. A1 Balakumar, Subramanian A1 Babu, Narayanan PB The Electrochemical Society YR 2004 SN 1099-0062 JF Electrochemical and Solid-State Letters VO 7 IS 2 SP G28 LK http://dx.doi.org/https://doi.org/10.1149/1.1635092 DO https://doi.org/10.1149/1.1635092 SF ELIB - SuUB Bremen
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