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1 Ergebnisse
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Properties of Cu Layers Deposited on TiZr-Based Barriers an..:
Balakumar, S.
;
Hara, Tohru
;
Kumar, Rakesh
..
Electrochemical and Solid-State Letters. 7 (2004) 8 - p. G175 , 2004
Link:
https://doi.org/10.1149/1.1763811
RT Journal T1 <Title>Properties of Cu Layers Deposited on TiZr-Based Barriers and CMP Compatibility of the Barriers</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_1.1763811&Exemplar=1&LAN=DE A1 Balakumar, S. A1 Hara, Tohru A1 Kumar, Rakesh A1 Wakabayashi, Takamasa A1 Uchida, Minoru PB The Electrochemical Society YR 2004 SN 1099-0062 JF Electrochemical and Solid-State Letters VO 7 IS 8 SP G175 LK http://dx.doi.org/https://doi.org/10.1149/1.1763811 DO https://doi.org/10.1149/1.1763811 SF ELIB - SuUB Bremen
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