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Additives for Superconformal Electroplating of Ag Thin Film..:
Ahn, Eung Jin
;
Kim, Jae Jeong
Electrochemical and Solid-State Letters. 7 (2004) 10 - p. C118 , 2004
Link:
https://doi.org/10.1149/1.1793811
RT Journal T1 <Title>Additives for Superconformal Electroplating of Ag Thin Film for ULSIs</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_1.1793811&Exemplar=1&LAN=DE A1 Ahn, Eung Jin A1 Kim, Jae Jeong PB The Electrochemical Society YR 2004 SN 1099-0062 JF Electrochemical and Solid-State Letters VO 7 IS 10 SP C118 LK http://dx.doi.org/https://doi.org/10.1149/1.1793811 DO https://doi.org/10.1149/1.1793811 SF ELIB - SuUB Bremen
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