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1 Ergebnisse
1
Low-Temperature Silicon Wafer-Scale Thermocompression Bondi..:
Park, Gil-Soo
;
Kim, Yong-Kook
;
Paek, Kyeong-Kap
...
Electrochemical and Solid-State Letters. 8 (2005) 12 - p. G330 , 2005
Link:
https://doi.org/10.1149/1.2077077
RT Journal T1 <Title>Low-Temperature Silicon Wafer-Scale Thermocompression Bonding Using Electroplated Gold Layers in Hermetic Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_1.2077077&Exemplar=1&LAN=DE A1 Park, Gil-Soo A1 Kim, Yong-Kook A1 Paek, Kyeong-Kap A1 Kim, Jin-Sang A1 Lee, Jong-Heun A1 Ju, Byeong-Kwon PB The Electrochemical Society YR 2005 SN 1099-0062 JF Electrochemical and Solid-State Letters VO 8 IS 12 SP G330 LK http://dx.doi.org/https://doi.org/10.1149/1.2077077 DO https://doi.org/10.1149/1.2077077 SF ELIB - SuUB Bremen
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