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The Effects of Copper CMP Slurry Chemistry on the Colloidal..:
Ihnfeldt, Robin
;
Talbot, Jan B.
Journal of The Electrochemical Society. 153 (2006) 11 - p. G948 , 2006
Link:
https://doi.org/10.1149/1.2335982
RT Journal T1 <Title>The Effects of Copper CMP Slurry Chemistry on the Colloidal Behavior of Alumina Abrasives</Title> UL https://suche.suub.uni-bremen.de/peid=cr-10.1149_1.2335982&Exemplar=1&LAN=DE A1 Ihnfeldt, Robin A1 Talbot, Jan B. PB The Electrochemical Society YR 2006 SN 0013-4651 JF Journal of The Electrochemical Society VO 153 IS 11 SP G948 LK http://dx.doi.org/https://doi.org/10.1149/1.2335982 DO https://doi.org/10.1149/1.2335982 SF ELIB - SuUB Bremen
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